Study of Microstructural and Electrical Properties of the (P)A-Si : H/(N)C-Si Heterojunction: Uncooled Microbolometer Application

Authors

Khadidja Ketroussi
Departement de physique, Université des Sciences et de la Technologie Houari Boumediene Algérie
Rabah Cherfi
Departement de physique, Université des Sciences et de la Technologie Houari Boumediene Algérie
Hadj Yahia Seba
Departement de physique, Université des Sciences et de la Technologie Houari Boumediene Algérie, Departement de technologie des systèmes énergétiques et environnement, Université Ourgla, Algérie
Sonia Tata
Departement de physique, Université des Sciences et de la Technologie Houari Boumediene Algérie
Lamia Chabane
Departement de physique, Université des Sciences et de la Technologie Houari Boumediene Algérie
Abla Rahal
Departement de physique, Université des Sciences et de la Technologie Houari Boumediene Algérie

Synopsis

Recently, outstanding achievements have been made in the development of a novel class of uncooled microbolometer infrared (IR) focal plane arrays (FPAs), the ones based on Si diodes as temperature sensors [1-2]. The previous achievements in this field [1-4], stimulates the search for simple complementary metal-oxide semiconductor (CMOS) compatible technological solutions based on diode bolometers which would be suitable for mass production of IR FPAs with adequate performance for many civilian applications [4]. Indeed, to achieve high temperature resolution, the thermodiode must have a high temperature sensitivity and a linear dependence of the output over a wide temperature range.

ICCAP2021
Published
March 8, 2022